M2M MULTI 2000便攜版臺(tái)式超聲波相控陣探傷儀
M2M MULTI 2000便攜版臺(tái)式超聲波相控陣探傷儀
M2M MULTI2000 便攜版
技術(shù)規(guī)格
acquisition | acquisition trigger on event (threshold, echo, etc.), acquisition on user-specified trigger (e.g., time, coder) choice of data (e.g., RF, peaks, elementary A-Scan), real-time imaging, user-specified configuration public file format for parameters (XML) and data (binary), max. data flow 30 MB/s | |
phased-array | custom focusing, electronic scanning, sectorial scanning, DDF inspection modes: pulse-echo and transmit-receive modes fast multiplexing, corrected images (e.g., sectorial B-Scan, C-Scan) | |
pulsers | adjustable voltage: 10 to 80V with 1V step, negative rectangular pulse adjustable width: 30 ns to 625 ns, step of 2.5 ns, rise time < 10 ns (80V, 50 ?), max. PRF: 30 KHz | |
receivers | bandwidth: 0.8 to 20MHz, adjustable gain on each channel from 0 to 80 dB adjustable analog DAC on 50 dB (max. 40 dB/µs) synchronized on events cross-talk between two channels > 50 dB, max. input signal amplitude: 0.8 Vpp | |
digitizer | max. sampling frequency: 100 MHz (adjustable from 100 MHz to 6.6 MHz), range : 10 bits input impedance: 50 ?, global delay: 0 up to 1.6 ms, step of 10 ns delay-laws at transmission/reception: 0 to 20 µs, step of 2.5 ns digitizing depth: up to 50,000 samples (8,000 samples max. per elementary channel) | |
embedded processors | FPGA on CPU-board | |
hardware configuration | Standard box | Rugged box |
Multiplexed architecture: 16x64 * | Multiple device capability IP 50 - Fanless Operating temperature : -10°C > 50°C | 14°F > 122°F | |
NDT simulation | CIVA subset into Multi2000 software, complete description of the inspection configuration focal-laws and associated ultrasonic field computation | |
compatibility | CIVA, NDT kit / ULTIS | |
platform | Windows-based PC, USB2 link between Hardware and PC (desktop or laptop) | |
dimensions | Standard box | Rugged box |
L x W x H: 212mm x 145mm x 70mm - Weight: ~1,3kg (battery included) | L x W x H: 200mm x 150mm x 100mm - Weight: ~2,6kg | |
I-O | 1 Hypertronix connectors, 3 encoders input, 1 external trigger 1 USB2, 2 LEMO connectors (type 00) External power supply input |
Performance may be reduced depending on the settings.
* A 8x32 version, co-developed with Airbus Group, also exists.
* A 8x32 version, co-developed with Airbus Group, also exists.